| Part Number |
Process |
Usable
Gates |
Total
Pads |
Max
System
Clock
(MHz) |
5V
Support |
Core
Voltage
[V] |
Memory
[bits] |
USB |
PCIe |
PLL |
| CX6500 |
0.13µ |
8M |
up to 896 |
300 |
|
1.2 |
10M |
Can include any
mixed signal IP |
|
The ChipX Embedded Array product family offers a unique mix of performance, density, efficiency and logic configurability. ChipX Embedded Arrays are targeted at customers seeking near standard cell performance and device cost combined with the ability to build derivatives quickly and inexpensively. ChipX Embedded Arrays combine built-in, silicon proven, industry standard I/Os, standard cell memories and a wide choice of mixed signal IP with the well-proven X-Cell™ architecture to provide industry leading performance using our advanced high-speed 0.13µ processes.
Features and Benefits
- Product families in 0.13u HS
- Metal configurable logic enables fast wafer fabrication and re-spins.
- Re-spins and derivatives can be implemented quickly with re-synthesis and no time-consuming and risky ECOs.
- High density, high performance Standard Cell SRAM Memory of up to 10Mbits
- Up to 300 MHz maximum global operating frequency with greater than 20 levels of logic, 1 GHz local
- True ASIC gate count of up to 8M usable gates, using ChipX’s fine grain Structured ASIC logic fabric
- 1.2V core operating voltage
- Wide range of Standard Cell I/O options, including LVTTL, LVCMOS, HSTL, SSTL (18/2/3), LVDS (up to 500 Mbps), RSDS, PCI, PCI-X, XOSC, and others
- DDR/DDRII PHY up to 500Mbps
- Commercial and Industrial grade temperature libraries
- Configurable PLLs with Spread Spectrum tracking, output range of 10 MHz – 1 GHz
- Multiple DLLs with output frequency of up to 400 MHz can be placed in the logic area.
- Packages from 40 QFN to 896 PBGA
- Mixed signal IP can be integrated in any Embedded Array
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