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ChipX Director of Engineering Services Speaks On PCI Express |
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ChipX
Director of Engineering Services Speaks On PCI Express Integration at PCI-SIG
DevCon 2006
Santa Clara, CA – June 6, 2006 – ChipX, the Structured ASIC leader,
today announced that Wayne Locke, Director of Engineering Services, will present
a paper at the upcoming PCI-SIG Developers Conference, June 8-9, 2006, at the
San Jose McEnery Convention Center, San Jose, California. ChipX will also participate in the Sponsor
Exhibit Area (booth #9), showcasing its most recent product development kit for
PCI Express and an easy migration path from prototyping to volume
production.
Locke’s presentation, “The Nuts and Bolts of Integrating PCI Express into Your Design” (Track 4, Session 14), offers managers and engineers an overview of the challenges involved in selecting and integrating various IP components, as well as choosing the lab equipment and setup required to test the PCI Express subsystem and run key measurement parameters. Locke will describe the preparation required for interoperability and compliance testing and provide guidelines for estimating how much time it may take to successfully complete the integration and test. Methods for limiting risk and easing the migration from prototype FPGA to ASIC are also presented. Locke has more than 20 years of experience in the semiconductor industry. He has worked on a variety of IC design technologies, including CPUs, DSPs, wireless SoCs, and ASICs. He has held various engineering and management position at leading semiconductor companies, including Texas Instruments, VLSI Technology, PraireComm, and ChipX. At ChipX, Locke helps lead the team responsible for implementing customer designs, which include PCI Express technology.
About ChipX © 2006 ChipX Inc. All other products or service names mentioned herein are the property of their respective owners. |